Engineering Solutions
for Electronic Systems

ToffeeX is a cloud-based, physics-driven generative design software that uses physics simulations to steer the engineering process. It was developed specifically for designing complex parts that require fluid and thermal management, such as heat exchangers, heat sinks and valves. By enabling design up to 20 times faster than traditional methods, it helps engineering teams develop lighter, higher-performance components and shortens design cycles.

With Pada Engineering, we provide cold plate design, engineering services and supply for power electronics applications. With its innovative product approach and industry experience, Pada Engineering is a major player in the European heat sink market, serving a wide range of sectors including power electronics, renewable energy, medical, e-mobility, rail transportation, defence and RF signal processing.

With POLYRACK Aerospace GmbH, we focus on delivering customer-specific solutions for the aerospace and defence industry. We offer comprehensive solutions covering individual rugged system platforms with IP65+ protection and heat dissipation optimised to military standards, electromechanical components made of metal and plastic, Air Transport Racks (ATR), rugged backplanes to MIL standards for CPCI / VME64x / OpenVPX, and the development and integration of I/O cards to customer specifications.

With POLYRACK Electronic-Aufbausysteme GmbH, we offer integrated packaging solutions for the widest range of applications in the electronics industry. With more than 45 years of engineering expertise and relationships of trust with the world's leading electronics brands, POLYRACK operates on a global scale, from Europe to Asia and from North America to the Turkish market.

The product range covers 19" subrack and enclosure families, industrial PC and panel PC systems, CompactPCI / VMEbus / OpenVPX backplanes, DIN rail modules and customer-specific system platforms. Custom designs developed on the basis of standard catalogue products combine the cost advantage of series production with the flexibility of individual customer requirements. POLYRACK has a multi-technology manufacturing infrastructure including metal and plastic processing, aluminium extrusion and die-casting, plastic injection moulds, surface treatment, electronic assembly and logistics.

With Sheen Electronic Technology, we offer a broad portfolio of thermal interface products including thermal pads, tapes, liquids, adhesives and gap fillers. Certified to UL, CE, ISO9001, ISO 14001 and IATF16949, Sheen is an established thermal materials manufacturer with extensive international references.

YCCFAN Technology is a leading brand specialising in high-performance axial and centrifugal fans for a wide range of industries. Together with YCCFAN, which offers application-specific solutions with AC, EC and DC fan types, we design ventilation systems optimised for customer needs.

With Innodisk, we offer industrial-grade flash storage, DRAM modules, embedded camera modules, network and I/O expansion cards and edge AI systems. Founded in Taiwan in 2005, Innodisk designs its products for extreme temperatures, shock and vibration, unstable power and long product life cycles; we integrate them into the enclosures and thermal solutions of our other brands.

With Aetina we offer Jetson-based edge AI systems, in-vehicle AI computers, GPU-expansion workstations, short-depth 2U AI servers and MXM / PCIe GPU cards. Founded in Taiwan in 2012 and part of the Innodisk Group since 2013, Aetina develops field-ready edge AI solutions; as its authorised distributor in Türkiye we plan these systems together with our enclosure and thermal solutions.