Sheen Electronic Technology

Materials That Carry Heat Away

From semiconductor cooling to EV battery management, from 5G base stations to medical electronics — industry-leading thermal interface solutions.

What Is a Thermal Interface Material?

Heat transfer occurs through three mechanisms: conduction, convection, and radiation. When a chip is mounted directly onto a heat sink, microscopic air gaps form between the two surfaces.

Air trapped in these gaps has a thermal conductivity of only 0.026 W/m·K, severely limiting heat dissipation. Thermal Interface Materials (TIMs) fill these gaps, eliminating air and enabling efficient heat transfer.

Sheen's SF-series Silicone Pads reach up to 15 W/m·K, while the Carbon Fiber CSF series achieves 45 W/m·K — more than 1,700× better than air.

Conductivity Comparison

Thermal Fluid & Potting Series

Gels, grease, adhesives, and potting compounds — for complex gap geometries.

Non-Curing · SE Series

One-Part Thermal Gel

High Plasticity

Non-curing with excellent wet-out properties and low thermal impedance. Does not crack or flow. Ideal for assemblies with large thickness tolerances and fragile components.

Thermal Conductivity	2.0 – 10.0 W/m·K
Dispensing	Manual / Automated

Models

SE20SE30SE40SE50SE60SE80SE100

Applications: Automotive electronics, mobile phone and laptop processors, communication equipment.

Curing · SE-AB Series

Two-Part Thermal Gel

Elastomer Conversion

Cures to an elastomer at room temperature or with heat, maintaining required thickness. Provides shock absorption and can replace traditional silicone pads.

Thermal Conductivity	2.0 – 8.0 W/m·K
Post-Cure Hardness	Shore 00: 55±10

Models

SE200ABSE300ABSE400ABSE500ABSE600ABSE800AB

Applications: Automotive electronics, mobile phone and laptop processors, communication equipment.

Low Resistance · SG560 Series

Thermal Grease

Extremely Low Thermal Resistance

Excellent wet-out with 0.05mm minimum interfacial thickness and extremely low thermal resistance. No preheating required. Suitable for manual coating or screen printing.

Thermal Conductivity	1.0 – 5.0 W/m·K
Thermal Impedance	0.015 – 0.04 °C·in²/W
Min. Interface Thickness	0.05 mm
Operating Temp.	-50 ~ 150 °C

Models

SG560-10SG560-20SG560-30SG560-40SG560-50

Applications: Filling gaps between CPUs, GPUs, and heat sinks.

Bonding · TIV800 Series

Thermal Conductive Adhesive

Bonding and Curing

Silicone resin-based with excellent bonding, thermal conductivity, and electrical insulation. Provides long-term high-temperature resistance for reliable permanent bonds.

Thermal Conductivity	1.0 – 2.0 W/m·K
Full Cure (25°C)	24 hours
Bonding Strength	≥ 1.5 MPa
Operating Temp.	-50 ~ 200 °C

Models

TIV800-10TIV800-12TIV800-15TIV800-20

Applications: LED lighting, communication equipment, power devices.

Potting · US-5201 Series

Thermal Potting Compound

Potting and Curing

Cures to a thermally conductive elastomer. Good flowability and self-leveling. Combines device protection, insulation, and thermal conductivity in one product.

Thermal Conductivity	0.8 – 3.5 W/m·K
Cure Options	15°C – 100°C
Dielectric Strength	> 2.0 kV/mm

Models

US-5201(O)US-5201-10US-5201-15US-5201-20US-5201-25US-5201-30US-5201-35

Applications: PCB enclosures, inverters, vehicle chargers, automotive power modules.

Applications from Chip to Battery Pack